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DYNAFORM is made up of many modules as seen below. This overview brochure covers all the modules of DYNAFORM. |
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The Formability Simulation module of Dynaform is the center of the system. When coupled with a Stamping Specific Solver it includes all the necessary tools to perform an incremental forming analysis. |
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Blank Size Engineering is is DYNAFORM's one-step analysis module. Use it to develop part blanks and to create forming analysis plots - thinning, major and minor axis strain, forming zone, and safety zone. Also, use it to develop part nesting on sheetmetal coil stock. |
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Blank Size Engineering for NX is a unique version of BSE that has been integrated under the covers of Unigraphics NX. When installed, analysis functions can be performed using pull-downs within the Unigraphics user interface. |
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Die Face Engineering, operating within the DYNAFORM environment, easily generates and modifies draw radii, binder surfaces, addendum profiles/surfaces, PO lines, and drawbeads. |
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Die Structure Analysis simulates operational loads to analyze the design integrity of the die. |
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The Virtual Proving Ground (VPG) PrePost module provides users an advanced toolset to analyze the structure and performance of a part in its application given the characteristics imparted to the part during the manufacturing process. |
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DYNAFORM's Stamping Specific Solver is based on the LS/Dyna solver from LSTC. |
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Metalforming Article - Using data from Dynaform forming analysis, Isatec engineering is able to predict the amount of nickel chromium required to plate a part and attain a specific surface finish. |
