Dynaform

Dynaform ends this process of guessing that a die design will work before cutting steel. It eliminates rework, lowers costs, and ensures tooling is delivered on time and works to specifications – the first time.

Complete Die System Simulation Solution

Dynaform is the complete die system simulation solution. Dynaform allows the organization to entirely bypass soft tooling, reducing overall tryout time, lowering costs, increasing productivity, and providing complete confidence in die system design. It also allows evaluation of alternative and unconventional designs and materials for an optimal solution. The most cost-effective and accurate solution available, Dynaform is the clear choice among progressive organizations seeking to streamline the die analysis system.

One Simple Interface

Dynaform encompasses the entire die system process in one simple interface. By simulating every detail during the design state, Dynaform ensures the highest quality formed part and best manufacturing process. The system guides the engineer through cost estimation, quoting, die face design, and formability analysis. Then, in a virtual environment, moves the part through the stamping process inside the plant – station by station. Dynaform simulates trimming/shedding and scrap removal and analyzes die structrural integrity. Finally, Dynaform evaluates the part transfer process within the die system and simulates the behavior of the part during shipping.

A Solid Infrastructure

Dynaform offers NURBS based CAD surfaces capability. This allows Dynaform’s mesh-based technology to maintain full parametric associativity throughout the entire simulation process. LS-DYNA, the most powerful solver in its class, is the engine within Dynaform. Offering tremendous calculation power to support difficult modeling and simulation challenges within a die system, these powerful processing and solving technologies enable Dynaform to meet the needs of users today and those in the future.

The Most Accurate & Cost-Effective Solution

The clear price/performance leader in the industry, Dynaform offers pinpoint accuracy in every detail and is the key reason die designers all over the world have turned to Dynaofrm for the most precise analysis possible.

Dynaform includes many modules:

  • The Pre/Post-Processor allows all process design variables to be considered in a process analysis – punch, die, and slide surfaces, the actual part blank including addendum surfaces, the kinematics of a multi-action die, material specs, coatings, lubrication, and more.
  • Incremental analysis typically involves 200 to 400 time increments so that actual processes are modeled including the ever-increasing contact between punch and die surfaces.
  • Die Face Engineering (DFE) allows for fast setup of “what-if” scenearios for evaluation.
  • Blank Size Engineering (BSE) module provides one-step inverse analysis functions for the development of blanks and trim lines.
  • The VPG module can be used to analyze the finished part in its application for structure and performance after considering characteristics imparted to the part during manufacturing (i.e. thinning and work hardening).

Features

  • Blanking and Nesting
    • Blank Outline & Cost Estimation
  • Die Face Engineering
    • Binder development, Addendum Generation, and Drawbead Layout
  • Sheet Metal Forming, Tube Bending, and Hydroforming
    • Deep Draw and Stretch Forming Simulations
    • Progressive Die Line and Transfer Die Line Simulations
    • Trim Line Evaluation
    • Material Evaulation
    • Springback and Springback Compensation
    • Tonnage Prediction
  • Die Structural Integrity
  • Sheet Metal Transferring/Handling
  • Scrap Shedding/Removal

Benefits

Reduces Cost:

  • Avoid costly design flaws
  • Reduce scrap

Reduces Development Time:

  • Tryout time
  • Retooling

Improves Quality:

  • Simulation analysis provesd greater confidence in die design